NanoVia develops hyper speed microvia drilling process
NanoVia develops hyper speed microvia drilling process
NanoVia, LP has introduced HyperVia™ holographic microvia drilling technology for drilling current and next generation high-density 3G smart chip carrier packages. The HyperVia™ microvia drilling technology can produce microvias on randomly pitched grid arrays at process rates exceeding 100 per cent faster than current laser systems on the market; this through put rate is anticipated to triple within the next 10 months, once a new laser technology arrives from one of its strategic laser vendors.
The new HyperVia™ technology is the second iteration of an optical system licensed to Hitachi Via Mechanics, Japan, in a 4 year exclusive license. NanoVia has already delivered several optical sub-systems to Hitachi and will begin to ship modules as the technology enters the US and Asian markets.
