Skip to Main Content
Dingjun Xiao
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Multi-physics coupling aid uniformity improvement in pattern plating

Available to Purchase
Linxian Ji, Chong Wang, Shouxu Wang, Kai Zhu, Wei He, Dingjun Xiao
Journal: Circuit World
Circuit World (2016) 42 (2): 69–76.
https://doi.org/10.1108/CW-05-2015-0023
Published: 03 May 2016
View article titled, Multi-physics coupling aid uniformity improvement in pattern plating
Open the PDF for Multi-physics coupling aid uniformity improvement in pattern plating in another window
Add to Citation Manager for Multi-physics coupling aid uniformity improvement in pattern plating
Journal Articles

Multiphysics coupling simulation of RDE for PCB manufacturing

Available to Purchase
Linxian Ji, Chong Wang, Shouxu Wang, Wei He, Dingjun Xiao, Ze Tan
Journal: Circuit World
Circuit World (2015) 41 (1): 20–28.
https://doi.org/10.1108/CW-09-2014-0037
Published: 02 February 2015
View article titled, Multiphysics coupling simulation of RDE for PCB manufacturing
Open the PDF for Multiphysics coupling simulation of RDE for PCB manufacturing in another window
Add to Citation Manager for Multiphysics coupling simulation of RDE for PCB manufacturing
Journal Articles

Preparation of electronic-grade CuO for copper electrodeposition of printed circuit boards

Available to Purchase
Jianhui Lin, Chong Wang, Yuanming Chen, Wei He, Dingjun Xiao, Ze Tan
Journal: Circuit World
Circuit World (2014) 40 (4): 127–133.
https://doi.org/10.1108/CW-07-2014-0031
Published: 28 October 2014
View article titled, Preparation of electronic-grade CuO for copper electrodeposition of printed circuit boards
Open the PDF for Preparation of electronic-grade CuO for copper electrodeposition of printed circuit boards in another window
Add to Citation Manager for Preparation of electronic-grade CuO for copper electrodeposition of printed circuit boards
This Feature Is Available To Subscribers Only

or Create an Account

Close Modal
Close Modal