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Shijin Chen
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Journal Articles
Study on fine lines and undercut suppression of printed circuit board prepared by electrolytic etching
Available to PurchaseDenglin Fu, Yanan Wen, Jida Chen, Lansi Lu, Ting Yan, Chaohui Liao, Wei He, Shijin Chen, Lizhao Sheng
Journal:
Circuit World
Circuit World (2023) 49 (1): 1–12.
Published: 03 August 2021
Journal Articles
Fabrication and surface treatment of fine copper lines for HDI printed circuit board with modified full-additive method
Available to Purchase
Journal:
Circuit World
Circuit World (2017) 43 (3): 131–138.
Published: 07 August 2017
Journal Articles
A copper electroplating formula for BVHs and THs filling at one process
Available to Purchase
Journal:
Circuit World
Circuit World (2016) 42 (3): 141–151.
Published: 01 August 2016
Journal Articles
Study on process technique of PCBs with ladder conductive lines
Available to Purchase
Journal:
Circuit World
Circuit World (2015) 41 (1): 34–40.
Published: 02 February 2015
