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Keywords: Adhesives
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Journal Articles
Nano‐ and micro‐filled conducting adhesives for z‐axis interconnections: new direction for high‐speed, high‐density, organic microelectronics packaging
Available to Purchase
Journal:
Circuit World
Circuit World (2008) 34 (1): 3–12.
Published: 08 February 2008
...Rabindra N. Das; Frank D. Egitto; Voya R. Markovich Purpose The purpose of this paper is to discuss the use of epoxy‐based conducting adhesives in z‐axis interconnections. Design/methodology/approach A variety of conductive adhesives with particle sizes ranging from 80 nm to 15...
Journal Articles
Journal:
Circuit World
Circuit World (2000) 26 (3): 50–51.
Published: 01 September 2000
...David Kingsley Professor Johan Liu (Ed.) . Conductive Adhesives for Electronic Packaging . Electrochemical Publications , 1999 . , ISBN: ISBN: 0901150371 Publication Packaging Adhesives It is true to say that, until the 1990s, electronic manufacturing...
