...Dave Oglesby Alternatives to conventional oxides were introduced in the mid‐1990s as part of innerlayer bonding processes that were significantly less expensive than reduced oxides. This was due to their lower equipment costs, shorter cycle times, and lower chemistry costs. However, the first...

... interconnections when they were inspected after 128 cycles of the thermal cycling test. Owing to the CTE mismatch, the solder joints of the flip chip on FR‐4 assemblies without underfill and encapsulation would develop cracks and open interconnections quickly during temperature cycling. Flip chip Bonding...

... © MCB UP Limited 2000 --> McGean-Rohco Bonding Multilayers Keywords McGean-Rohco, Bonding, Multilayers McGean-Rohco has announced that their white oxide DuraBOND process has been approved to the Telcordia Technologies (Bellcore) specification. A little over six...