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Keywords: Chip size package
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Journal Articles
A low‐cost solder‐bumped chip scale package ‐NuCSP
Available to Purchase
Journal:
Circuit World
Circuit World (1998) 24 (3): 11–25.
Published: 01 September 1998
... strength is 32.7g and standard deviation is about 4.3g. The failure location is in the solder and not at the UMB. © MCB UP Limited 1998 Chip size package Packaging Printed circuits Solders One of the most cost‐effective packaging technologies is that of direct chip attach (DCA...
