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Keywords: Chipscale packaging
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Journal Articles
Journal:
Circuit World
Circuit World (2002) 28 (2): 32–38.
Published: 01 June 2002
.... A comprehensive stress analysis is performed and comparisons are made for assembly deformation, stress/strain ranges, and creep responses. Equation 1 Equation 2 Equation 3 Equation 4 © MCB UP Limited 2002 Solder joints Chipscale packaging Microvias...
Journal Articles
Journal:
Circuit World
Circuit World (1999) 25 (4): 25–27.
Published: 01 December 1999
... products. © MCB UP Limited 1999 Printed circuit boards Chipscale packaging This enables the calculation of the optimum inner region routing length, Li,k by setting Ntk equal to Nout,k. (07) The I/Os that are placed...
