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1-6 of 6
Keywords: Circuits
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Journal Articles
SCB and SMI: two stretchable circuit technologies, based on standard printed circuit board processes
Available to PurchaseJan Vanfleteren, Thomas Loeher, Mario Gonzalez, Frederick Bossuyt, Thomas Vervust, Ingrid De Wolf, Michal Jablonski
Journal:
Circuit World
Circuit World (2012) 38 (4): 232–242.
Published: 16 November 2012
...Jan Vanfleteren; Thomas Loeher; Mario Gonzalez; Frederick Bossuyt; Thomas Vervust; Ingrid De Wolf; Michal Jablonski Purpose In the past 15 years stretchable electronic circuits have emerged as a new technology in the domain of assembly, interconnections and sensor circuits and assembly...
Journal Articles
The influence of test method, conductor profile and substrate anisotropy on the permittivity values required for accurate modeling of high frequency planar circuits
Available to Purchase
Journal:
Circuit World
Circuit World (2012) 38 (4): 219–231.
Published: 16 November 2012
...Allen F. Horn, III; Patricia A. LaFrance; John W. Reynolds; John Coonrod Purpose The purpose of this paper is to help high frequency circuit designers understand how to choose the best permittivity value for a laminate material for accurate modeling. Design/methodology/approach In this paper...
Journal Articles
Printing technology for ubiquitous electronics
Available to Purchase
Journal:
Circuit World
Circuit World (2010) 36 (2): 40–47.
Published: 18 May 2010
... generally appreciated in public discussions of printed electronics. The transfer printing process offers a unique way to make cost‐effective use of silicon integrated circuits which are much smaller than any that appear in products today, and may have ramifications beyond the original target of tags...
Journal Articles
“System in package technology” – design for manufacture challenges
Available to PurchaseAndrew Richardson, Chris Bailey, Jean Marc Yanou, Norbert Dumas, Dongsheng Liu, Stoyan Stoyanov, Nadia Strusevich
Journal:
Circuit World
Circuit World (2007) 33 (1): 36–46.
Published: 13 February 2007
... sets of physics are interrelated through the coefficient of thermal expansion of each material (or the thermal mismatch) which produces stress that can result in failure. © Emerald Group Publishing Limited 2007 Electronics industry Circuits Electromechanical devices Reliability...
Journal Articles
Non‐planar interconnect
Available to Purchase
Journal:
Circuit World
Circuit World (2005) 31 (2): 10–14.
Published: 01 June 2005
... of the line segments on the mask in order to compensate for diffractive line broadening. For more extreme 3D geometries it becomes necessary to consider the use of holographic masks. Originality/value Printed circuit boards and semiconductor wafers are nominally flat and traditional lithographic processes...
Journal Articles
WECC
Free
Journal:
Circuit World
Circuit World (1999) 25 (2)
Published: 01 June 1999
... © MCB UP Limited 1999 --> Circuits Electronics industry WECC WECC Global electronic circuits council forms and signals global unity in support of ITA 2 Keywords Circuits, Electronics industry,WECC Associations representing the electronic circuits industries...
