Keywords: Conductive adhesive
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Pre-curing investigation of filling conductive paste in prepreg to interconnect two multilayer structures of backboard for press-fit application

Shouxu Wang, Ting Yang, Yuanming Chen, Wei He, Yongsuan Hu, Xinhong Su
Journal: Circuit World
Circuit World (2016) 42 (3): 104–109.
https://doi.org/10.1108/CW-06-2015-0027
Published: 01 August 2016
... et al., 2010): Interconnections PCB technology Resistance Bond strength Conductive adhesive Multilayer Pre-curing Press fit Backboard Printed circuit board (PCB) calls for further development to match its various applications for electronic products. Communication backboard...
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