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Keywords: Conductive adhesives
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Journal Articles
Journal:
Circuit World
Circuit World (1999) 25 (2): 11–17.
Published: 01 June 1999
...” materials: substrate, conductive inks, dielectrics, conductive adhesives and non‐conductive adhesives/encapsulants. Underfills, required for flip chips, are commonly classified as packaging materials, but they are polymer‐based systems that are a close kin of PTF and will be described later. Figure 1...
