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Keywords: Copper electroplating
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Journal Articles
Effects of additives on via filling and pattern plating with simultaneous electroplating
Available to Purchase
Journal:
Circuit World
Circuit World (2023) 49 (2): 105–112.
Published: 12 August 2021
... Publishing Limited 2021 Emerald Publishing Limited Licensed re-use rights only Additive Copper electroplating Via filling Blind via Cu electroplating is one of the most important process in the fabrication of microelectronics interconnection, especially in the Integrated Circuits (IC...
Journal Articles
Electrochemical and analytical study of electroplating additive in copper plating solution for microvia filling
Available to Purchase
Journal:
Circuit World
Circuit World (2019) 45 (3): 124–131.
Published: 16 August 2019
...Zhihua Tao; Guanting Liu; Yuanxun Li; Hua Su Purpose The adsorption and acceleration behavior of 3-mercaptopropyl sulfonate (MPS) were investigated by electrochemical tests for microvia filling by copper electroplating. Design/methodology/approach The synergistic effects of one suppressor...
Journal Articles
A copper electroplating formula for BVHs and THs filling at one process
Available to Purchase
Journal:
Circuit World
Circuit World (2016) 42 (3): 141–151.
Published: 01 August 2016
...Jia Liu; Jida Chen; Zhu Zhang; Jiali Yang; Wei He; Shijin Chen Purpose The purpose of this paper is to introduce a new copper electroplating formula which is able to fill blind microvias (BVHs) and through holes (THs) at one process through a direct current (DC) plating method. Design...
