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Keywords: Cu plating
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Journal Articles
Filling through holes and blind microvias with copper using reverse pulse plating and insoluble anodes
Available to Purchase
Journal:
Circuit World
Circuit World (2012) 38 (3): 113–123.
Published: 17 August 2012
... plating Cu plating Microvias This paper presents the results of systematic investigations of complete through hole filling for cores using a Cu electroplating process as an alternative to the common paste plugging process (Carano, 2007). The technology is targeted at both HDI production and also...
