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Keywords: DBC
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Journal Articles
Journal:
Circuit World
Circuit World (2021) 47 (2): 146–152.
Published: 22 July 2020
...Ryszard Kisiel; Marek Guziewicz; Andrzej Taube; Maciej Kaminski; Mariusz Sochacki Purpose This paper aims to investigate the sintering and solid liquid interdiffusion bonding (SLID) techniques to attach AlGaN/GaN-on-Si chips to direct bond copper (DBC) substrate. The influence of metal layers...
