...) ratio of a conductor. Printed circuit boards Manufacturing Density In mast cases, conductor width is dictated by: (i) the component packing density; (ii) the minimum spacing between conductors and/or components; (iii) the number of rejects during PB manufacture (usually...

...H. Holden Ball grid arrays, chip‐sized grid arrays, direct chip attach and flip chip are packages which are increasingly penetrating the market. However,the challenge to PCB fabricators will be how to meet the need imposed by these packages in terms of increased circuit density. Shrinking traces...