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Keywords: Elastoplasticity
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Journal Articles
Elastic, elastic‐plastic and creep analyses of wafer level chip scale package solder joints on microvia build‐up printed circuit boards
Available to Purchase
Journal:
Circuit World
Circuit World (2001) 27 (1): 20–31.
Published: 01 March 2001
.... In the development of solder‐bumped WLCSP on high‐density PCB or on the substrate in a PBGA package, the following must be noted and understood (Lau, 2000b): Printed circuit boards Elastoplasticity Chip scale packaging Build‐up technology Microvias Since the publications by Tsukada et al...
