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Keywords: Failure
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Journal Articles
Cracking phenomena on flexible‐rigid interfaces in PCBs under thermo cycling loading
Available to Purchase
Journal:
Circuit World
Circuit World (2009) 35 (2): 18–22.
Published: 15 May 2009
... these devices are submitted to thermal cycling. Design/methodology/approach A device was proposed in order to evaluate the reliability of flex‐rigid interconnections. Thermal cycling tests were performed in an environmental chamber and failure mechanisms investigated using optical and scanning electron...
