... electroplated with tin‐lead (Sn‐Pb). With the advent of Pb‐free electronics finishing, the risk of tin whiskers is again a significant concern. This paper will review the theories behind whisker formation, identify the common characteristics of same, and demonstrate how Pb‐free electroplating processes can...

...P. Bratin; Michael Pavlov; Gene Chalyt This paper extends our study of the sequential electrochemical reduction analysis (SERA) technique for evaluation of various alternative finishes and it discusses the application of the SERA technique to assess the surface conditions of the silver finish...

... documented. Organic finishes based on substituted imidazoles address some of the assembly requirements, as do precious metal finishes such as gold and palladium. However, both types of solderable finish have limitations or undesirable characteristics. This paper discusses and compares other non‐precious...

..., lead‐free alternative. To answer these needs, Motorola have developed a lead‐free, immersion plating technology for the surface finish of PCB printed circuit board bond pads. The Motorola development work has focused on the metallurgical system of tin‐bismuth, which is a simple eutectic system similar...