... the three-dimensional finite element algorithm. Findings – The simulated results showed great shearing strength between the chipset and the printed circuit board. The position of chip exerts great influence on the distribution of temperature field and thermal stress field of circuit board...

...) with gull‐wing leads. A commercial finite element code, ABAQUS, was employed to perform a two‐dimensional plane stress analysis. While all other constituents of the PQFP assembly were assumed to be linear elastic, the solder joint was considered to be elastic‐viscoplastic. The creep model was adopted from...