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Keywords: Flip‐chip‐on‐board
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Journal Articles
Journal:
Circuit World
Circuit World (1998) 24 (1): 7–12.
Published: 01 January 1998
...Daniel R. Gamota; Cindy M. Melton Encapsulant materials for flip‐chip‐on‐board (FCOB) were developed to address issues that have been observed during assembly of consumer electronic products on a high volume manufacturing FCOB/SMT line. The viscosity, surface tension, and filler particle sizes...
