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Keywords: Form factor
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Journal Articles
Journal:
Circuit World
Circuit World (2023) 49 (2): 202–210.
Published: 06 September 2021
...Chun Hei Edmund Sek; M.Z. Abdullah; Kok Hwa Hwa Yu; Shaw Fong Wong Purpose This study aims to simulate molded printed circuit board (PCB) warpage behavior under reflow temperature distribution. Simulation models are used to estimate dynamic warpage behavior for different form factor sizes...
