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Keywords: HEMT
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Journal Articles
Journal:
Circuit World
Circuit World (2021) 47 (2): 146–152.
Published: 22 July 2020
... 7.5 MPa. Findings Ag-, Au-backside covered high electron mobility transistor (HEMT) chips can be assembled on Sn-plated DBC substrates by SLID technology. In case of sintering technology, Cu- or Ag-backside covered HEMT chips can be assembled on Ag- or Ni/Au-plated DBC substrates. The SLID process...
