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Keywords: IC substrate
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Journal Articles
Improvement of plating uniformity for copper patterns of IC substrate with multi-physics coupling simulation
Available to PurchaseJing Xiang, Yuanming Chen, Shouxu Wang, Chong Wang, Wei He, Huaiwu Zhang, Xiaofeng Jin, Qingguo Chen, Xinhong Su
Journal:
Circuit World
Circuit World (2018) 44 (3): 150–160.
Published: 10 July 2018
... as IS1, IS2 and IS3, respectively. Cathode patterns with different exposed copper ratios (ECRs) and auxiliary cathode (AC) were designed for copper interconnection of IC substrate. The schematic diagrams of various ECRs (20, 50 and 80 per cent) were shown in Figure (d), (e) and (f...
Journal Articles
Experimental study on micro-drills wear during high speed of drilling IC substrate
Available to Purchase
Journal:
Circuit World
Circuit World (2014) 40 (2): 61–70.
Published: 29 April 2014
...Linfang Wang; Lijuan Zheng; Cheng yong Wang; Shan Li; Yuexian Song; Lunqiang Zhang; Peng Sun Purpose – Compared with the traditional printed circuit board (PCB) drilling process, the technology of drilling IC substrate is facing more problems, such as much smaller hole diameter, more intensive...
