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Keywords: Joining
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Journal Articles
Development of Flip‐chip Joining Technology on Flexible Circuitry Using Anistropically Conductive Adhesives and Eutectic Solder*
Available to Purchase
Journal:
Circuit World
Circuit World (1996) 22 (2): 19–24.
Published: 01 August 1996
... electrical performance. In this paper, flip‐chip test design considerations,process development and driving forces for adhesive joining and soldering flip‐chip processes will be given. Reliability test results of flip‐chip interconnection technology using conductive adhesive joining will also be presented...
