... time and to prevent the deterioration of the thermoplastic surfaces. Conductor pattern Electroforming MID Thermoplastic substrate Hot pressing Adhesion A molded interconnect device (MID) is a common term for an injection-molded thermoplastic part with integrated electronic circuit...

...G. van Alst; P. van Dijk; F. van Meijl Various methods are described of making separable electrical connections to MID structures. The first part discusses the use of a copper plated,glass filled plastic substrate as a contact surface. It is shown that the morphology is different from...