...Brent Roeger Purpose The purpose of this paper is to demonstrate laser microvia drilling of polyimide thin films from multiple sources before metallic sputtering. This process flow reduces Flexible Printed Circuit Board (FPCB) material, chemical and operational costs by 90 per cent...

... multilayer process based on local overmolding is developed. To investigate this new process, a 3D demonstrator is designed, simulated and fabricated. Various technologies such as injection molding, maskless laser assisted electroless metallization, overmolding and laser via drilling are used. Findings...

... © MCB UP Limited 2002 --> Enthone GSPK Metallization Enthone and GSPK "envision" the "pearl" of direct metallization Keywords: Enthone, GSPK, Metallization GSPK Engineering, in partnership with Enthone Ltd, has installed a new state-of-the-art direct...

...Michael Carano While the interest in alternative metalization processes for the manufacturing of printed wiring boards is extremely keen, the long‐term reliability of plated through holes fabricated with these electroless copper alternatives remains in question. However, during the last three years...