Keywords: Miniaturization
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Circuit World (2003) 29 (4): 28–33.
Published: 01 December 2003
...James Shang; Yung‐I Liu Miniaturization, with increased functionality and use of high‐density packages is a rapidly growing facet of the electronics industry. Low loss materials for high frequency applications, low Dk materials applied for high speed signal propagation and build...

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