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Keywords: Packaging industry
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Journal Articles
Journal:
Circuit World
Circuit World (1998) 24 (2): 6–9.
Published: 01 June 1998
... with the name X‐Link (pronounced Crosslink): 1. 1.X‐Link I (XL); 2. 2.X‐Link II (XXL). © MCB UP Limited 1998 Packaging industry Printed circuits Product development Semiconductors Bypass capacitors can be integrated into the board by using the power and ground plane...
