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Keywords: Pattern plating
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Journal Articles
Multi-physics coupling aid uniformity improvement in pattern plating
Available to Purchase
Journal:
Circuit World
Circuit World (2016) 42 (2): 69–76.
Published: 03 May 2016
...Linxian Ji; Chong Wang; Shouxu Wang; Kai Zhu; Wei He; Dingjun Xiao Purpose The uniformity of electrodeposition is the key to successful application of pattern plating because the quality of electrodeposited copper layer has a huge impact on the performance of printed circuit boards (PCBs...
