...George Milad Purpose The purpose of this paper is to present new developments in electrolytic tin plating designed to eliminate the formation of whiskers over time, when tin is plated on copper. Design/methodology/approach Two main approaches were undertaken to achieve the desired results...

... © MCB UP Limited 2001 --> Labtech Plating Labtech trebles plating capacity Keywords: Labtech, Plating Labtech has announced that it is trebling its plating capacity. The company has recently installed a new electrolytic nickel and hard and soft gold line...

.... For further information, please contact Chemetall Ltd. Tel: +44 (0) 1296 399233; Fax: +44 (0) 1296 399211. © MCB UP Limited 2000 --> Chemetall Plating New Chemetall process gives precise component positioning on circuit boards Keywords Chemetall, Plating Chemetall Plating...

...Steve Castaldi; Dennis Fritz; Ron Schaeffer This paper explores the capability of electroless copper deposition plus acid copper electroplating to metallize high aspect ratio microvias. © Company 1999 Copper Microvias Plating Printed circuit boards The production of build‐up...

... © MCB UP Limited 1999 --> Chemring Plating New laboratory-sized reverse plating unit Keywords Chemring,Plating A compact,laboratory-sized reverse pulse plating unit has been developed by Chemring Plating Systems. Called the CPS 60, this unit provides 10 amps...