...George Milad Purpose The purpose of this paper is to present new developments in electrolytic tin plating designed to eliminate the formation of whiskers over time, when tin is plated on copper. Design/methodology/approach Two main approaches were undertaken to achieve the desired results...

... Labtech trebles plating capacity Keywords: Labtech, Plating Labtech has announced that it is trebling its plating capacity. The company has recently installed a new electrolytic nickel and hard and soft gold line, a new fully automatic electroless nickel gold line and a new hot...

... to be treated and hence operating costs. For further information, please contact Chemetall Ltd. Tel: +44 (0) 1296 399233; Fax: +44 (0) 1296 399211. © MCB UP Limited 2000 --> Chemetall Plating New Chemetall process gives precise component positioning on circuit boards Keywords...

... to plate the sidewalls of the vias limits the aspect ratio possible. Laser technology here demonstrates the capability to produce test vias beyond the production standards of today’s build up multilayer production. This paper explores the limits of metallization and electroplating to produce microvias...

... © MCB UP Limited 1999 --> Chemring Plating New laboratory-sized reverse plating unit Keywords Chemring,Plating A compact,laboratory-sized reverse pulse plating unit has been developed by Chemring Plating Systems. Called the CPS 60, this unit provides 10 amps...