... Thermoelectricity Porosity Substrates © Emerald Group Publishing Limited 2009 Mikael Lindeberg This paper describes the processes that rely on ion track techniques and which allow new microsystems and microcircuits to be integrated directly in a flexible printed circuit board (PCB...

... and Au, Ni and solder, and the control of the porosity of the Au surface. A suitable increase in phosphorous content in the nickel deposit reduces the hyperactive corrosion during immersion gold process. In addition, a stabilizer system that gives consistent performance across the entire bath life...