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Keywords: Press fit
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Journal Articles
Journal:
Circuit World
Circuit World (2016) 42 (3): 104–109.
Published: 01 August 2016
...Shouxu Wang; Ting Yang; Yuanming Chen; Wei He; Yongsuan Hu; Xinhong Su Purpose The purpose of this paper is to form high density interconnection (HDI) of backboard for press-fit applications with the pre-curing conditions of conductive paste. The best condition of pre-curing conductive paste...
