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Keywords: Pulse reverse plating
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Journal Articles
Filling through holes and blind microvias with copper using reverse pulse plating and insoluble anodes
Available to Purchase
Journal:
Circuit World
Circuit World (2012) 38 (3): 113–123.
Published: 17 August 2012
... walls to give a complete fill. However, that process has several disadvantages such as being slow (less productivity) and a higher risk for voids (Figure 2). © Emerald Group Publishing Limited 2012 Printed circuits Electrical connections Through hole filling Laser drilling Pulse reverse...
