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Keywords: Semiconductor devices
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Journal Articles
Nano‐ and micro‐filled conducting adhesives for z‐axis interconnections: new direction for high‐speed, high‐density, organic microelectronics packaging
Available to Purchase
Journal:
Circuit World
Circuit World (2008) 34 (1): 3–12.
Published: 08 February 2008
... for z‐axis interconnections. © Emerald Group Publishing Limited 2008 Adhesives Electronic engineering Printed circuits Semiconductor devices The needs of the semiconductor marketplace continue to drive density into semiconductor packages. The high end of this market appears...
