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Keywords: Semiconductor technology
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Journal Articles
A multilayer process for the connection of fine‐pitch‐devices on molded interconnect devices (MIDs)
Available to Purchase
Journal:
Circuit World
Circuit World (2009) 35 (2): 23–29.
Published: 15 May 2009
.... The proceeding level of miniaturization in semiconductor technology and associated industries already results in immense demands for the packaging and assembly of related devices. This includes the packaging of single silicon dies on the one hand, and their implementation in overall systems on the other. Since...
