...Ryszard Kisiel; Marek Guziewicz; Andrzej Taube; Maciej Kaminski; Mariusz Sochacki Purpose This paper aims to investigate the sintering and solid liquid interdiffusion bonding (SLID) techniques to attach AlGaN/GaN-on-Si chips to direct bond copper (DBC) substrate. The influence of metal layers...

...Alena Pietrikova; Tomas Girasek; Lubomir Livovsky; Juraj Durisin; Karel Saksl Purpose The purpose of this paper was to investigate an influence of a low temperature pressureless sintering process of silver paste on the quality of sintered joints. Design/methodology/approach The authors...

...Peter Lukacs; Alena Pietrikova; Pavol Cabuk Purpose The purpose of this paper is to find optimal sintering conditions of silver-based nano-inks for achieving the high electrical conductivity of the deposited layers applied on polyimide foils as well as the influence of ageing on the electrical...

... these problems inherent in typical polymer thick film inks. This new product is based on transient liquid‐phase sintering wherein the metallic components of the formulation sinter at a relatively low temperature, resulting in a highly conductive continuous metal network. The sintering is achieved through...