...C.A. Smith Purpose The aim is to focus on the application of X‐rays in the failure analysis of electronic devices and systems, with an emphasis on X‐ray radiography and X‐ray spectroscopy. Design/methodology/approach The theory behind X‐ray radiography and X‐ray spectroscopy is reviewed...

...C.A. Smith Purpose The purpose of the paper is to discuss the chemical characterisation of inorganic and organic materials found in electronic systems. Design/methodology/approach The paper provides an introduction to Fourier transform infrared spectroscopy, which is used for the chemical...

...C.G.L. Khoo; Johan Liu Three common glob top encapsulant materials, two epoxy‐based, and one silicone‐based, were characterized prior to temperature cycling using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical spectroscopy (DMS), gas chromatograph‐mass...