...David H. Ormerod A new high performance immersion tin incorporating a co‐deposited organic provides a highly solderable PWB surface finish. The process is described and includes solderability data after accelerated aging and extended processing. Studies of SIR, metallic dendritic growth and ionic...

...F.D. Bruce Houghton A problem exists with electroless nickel/immersion gold (E.Ni/I.Au) board surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open circuit. The solder joint cracks and separates when put under stress or when...

... © MCB UP Limited 1999 --> IPC Surface finishing IPC announces dates for surface finishes conference Keywords: IPC, Surface finishing IPC has announced that the third annual IPC PWB Surface Finishes and Solderability National Conference is being held 22-23...

... © MCB UP Limited 1999 --> IPC Surface finishing Shipley Ronal announces restructuring of European manufacturing Keywords: IPC, Surface finishing On 26 April 1999 Shipley Company announced the results of a three-month review of operations for its newly formed...

...Bernhard Wessling As an alternative to hot air levelling, a fundamentally new surface finish chemistry and process for solderability preservation of printed circuit boards is described: a pretreatment of the copper followed by an optimized formulation of an immersion tin. The precise...

...Zequn Mei; Ali Eslambolchi Multi‐layer surface finish, from the bottom to top, of electroless Ni, electroless Pd, and immersion Au (Ni/Pd/Au) have been introduced in the printed circuit board (PCB) industry recently. This paper reports an evaluation of this surface finish from the perspective...

... to crack initiation and growth in the solder joints. Solder joint cracks have also been examined. Printed circuit boards Reliability Solder joints Surface finishing Environmental, processing and assembly issues are leading the printed wiring board industry to consider alternatives to hot air...

... Surface finishing As the new interconnect technologies such as ball grid array (BGA), flip chip, and chip on board (COB) progress, so do the requirements for smaller component pads on the printed boards. With this industry trend to miniaturize the interconnections and with conservationists...

... air. The boards are then aqueous cleaned and dried. The major problem of this coating is the variation of thickness and non‐flat surfaces. Figure 2 indicates a typical Ni/Au surface. There are two steps for this surface finish, a nickel coating followed by a gold coating. During...