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Keywords: System‐in‐a‐package
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Journal Articles
Integrated MEMS in package
Available to Purchase
Journal:
Circuit World
Circuit World (2012) 38 (4): 184–192.
Published: 16 November 2012
... of basic packaging fabrication processes for producing 3‐D structures and free‐standing structures, and a new MEMS manufacturing paradigm to build micro‐electromechanical (MEMS) for biomedical, optical, and RF communication applications. MEMS System‐in‐a‐package PCB manufacturing Laminations...
