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Journal Articles
A copper electroplating formula for BVHs and THs filling at one process
Available to Purchase
Journal:
Circuit World
Circuit World (2016) 42 (3): 141–151.
Published: 01 August 2016
...Jia Liu; Jida Chen; Zhu Zhang; Jiali Yang; Wei He; Shijin Chen Purpose The purpose of this paper is to introduce a new copper electroplating formula which is able to fill blind microvias (BVHs) and through holes (THs) at one process through a direct current (DC) plating method. Design...
