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Keywords: Tensile-compression test
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Journal Articles
Method development for the cyclic characterization of thin copper layers for PCB applications
Available to Purchase
Journal:
Circuit World
Circuit World (2014) 40 (2): 53–60.
Published: 29 April 2014
... characterized. The mechanical properties of these copper layers were determined in cyclic four-point bend tests and in cyclic tensile-compression tests, as their behavior under changing tensile and compression loads needed to be evaluated. Design/methodology/approach – Specimens for the four-point bend...
