...Mark Andrew Ashworth; Barrie Dunn Purpose This paper aims to present the results of a 32-year-old laboratory study of whisker growth from tin electrodeposits that was originally undertaken to gain an increased understanding of the phenomenon of tin whisker growth. Design/methodology/approach...

...David H. Ormerod A new high performance immersion tin incorporating a co‐deposited organic provides a highly solderable PWB surface finish. The process is described and includes solderability data after accelerated aging and extended processing. Studies of SIR, metallic dendritic growth and ionic...

...Bernhard Wessling As an alternative to hot air levelling, a fundamentally new surface finish chemistry and process for solderability preservation of printed circuit boards is described: a pretreatment of the copper followed by an optimized formulation of an immersion tin. The precise...