... © MCB UP Limited 2000 --> Excellon Automation Lasers Vias Excellon Automation introduces new laser via formation system Keywords: Excellon Automation, Lasers, Vias Excellon Automation is presenting the world's first laser via formation system with one autoloader...

...P.J. Palmer; D.J. Williams This paper explores the use of models of substrate behaviour to examine the wireability constraints on PCBs due to signal layers and buried and through vias. The importance of product scale as a factor affecting technology choice is examined in detail, and the factors...

... has put into production a sequential build HDI process that uses photoimageable dielectrics and semi‐additive copper metallization on a PWB substrate. Design capabilities for the current HDI process are 100μm/100μm line/space and 125μm /250μm via/pad. Plated through holes in the substrate are filled...

...Anton Kitai; Jim Morrison Drilling blind vias with lasers has become more and more popular over the past three years as PWB fabricators and OEMs recognize the benefits of a process that has high throughput, is versatile with materials, has a fairly large process window and requires little...