Skip Nav Destination
Close Modal
Update search
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
NARROW
Format
Journal
Type
Date
Availability
1-4 of 4
Keywords: Electronics
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Natural convective cooling of electronics contained in tilted hemispherical enclosure filled with a porous medium saturated by water-copper nanofluid
Available to PurchaseAbderrahmane Baïri, Jean-Gabriel Bauzin, Alexander Martín-Garín, Nacim Alilat, José Antonio Millán-García
International Journal of Numerical Methods for Heat & Fluid Flow (2019) 29 (1): 280–293.
Published: 30 October 2018
...Abderrahmane Baïri; Jean-Gabriel Bauzin; Alexander Martín-Garín; Nacim Alilat; José Antonio Millán-García Purpose The purpose of this study is to determine the thermal behavior of a hemispherical electronic device contained in a concentric hemispherical enclosure, cooled by means of free...
Journal Articles
Numerical and experimental study of free convection on wire-bonded QFN64b electronic package
Available to Purchase
International Journal of Numerical Methods for Heat & Fluid Flow (2017) 27 (6): 1323–1331.
Published: 05 June 2017
... with other QFN models with and without wire-bonding. Originality/value The correlations proposed in this survey help optimize the thermal design of the QFN64b electronic package used in many engineering fields. Figure 3. Evolution of ΔT̄ versus P Figure 2. Evolution...
Journal Articles
Surface temperature of electronic assemblies equipped with tilted and low-powered QFN64 subjected to free convection
Available to Purchase
International Journal of Numerical Methods for Heat & Fluid Flow (2017) 27 (6): 1304–1310.
Published: 05 June 2017
...Abderrahmane Baïri; Clara Ortega Hermoso; David San Martén Ortega; Iken Baïri; Zsolt Peter Purpose This work deals with the case of the quad flat non-lead 64 (QFN64) electronic package generating a low power range ranging from 0.01 to 0.1W. It is installed on one side of a printed circuit board...
Journal Articles
Natural convection in vertical channels with an auxiliary plate
Available to Purchase
International Journal of Numerical Methods for Heat & Fluid Flow (2002) 12 (6): 716–734.
Published: 01 September 2002
...Assunta Andreozzi; Oronzio Manca; Vincenzo Naso Research on natural convection in open channels is very extensive due to its role in many engineering applications such as thermal control of electronic systems. In this paper, a parametric analysis is carried out in order to add knowledge of heat...
