... in the specified design space. Optimum designs of the porous media slabs are achieved to minimise the maximum-wall temperature, thermal resistance and pressure drop and maximise the average heat transfer coefficient and figure of merit (FOM). Findings Results exhibited that the porous media material...

... are investigated in our previous research (Liu et al., 2019). The effects of geometric parameters on the frictional pressure drop, average Nusselt number and the relationship between thermal resistance and pumping power in the novel channel are presented. It is found that the performance of serpentine...

...Xiong Xiang; Yu Fan; Wei Liu; Aiwu Fan Purpose The purpose of this paper is to compare the thermal resistances between optimized gallium- and water-based heat sinks to show which one is superior. Design/methodology/approach Taking the thermal resistances of heat sinks as the goal function...

... algorithm. The optimized micro‐channel heat sink is simulated by computational fluid dynamics (CFD) method, and the total thermal resistance is calculated to compare with that of thermal resistance network model. Design/methodology/approach Taking the thermal resistance and the pressure drop as goal...

... and the maximum heat flux may exceed 90 W/cm². Also, when copper fins are 3 mm in height, 0.2 mm in thickness, 53 in number and spaced out 1.0 mm apart, the optimum total thermal resistance of a vapour chamber‐based thermal module is 0.28 ^○C/W. Originality/value The Sapphire Atomic...

... Metals Heat transfer Thermal resistance Diffusion Bonding Temperature distribution E potential energy of the system F_i(ρ_{i) embedding energy of atom i with electron density ρi q heat flux h heat}...

...Baodong Shaoi; Lifeng Wang; Jianyun Li; Zhaowei Sun Purpose The purpose of this paper is to optimize the configuration sizes of micro‐channel cooling heat sink using the thermal resistance network model. The optimized micro‐channel heat sink is simulated by computational fluid dynamics method...

... of such electronic packages are characterized by package thermal resistance called θ‐JA and are widely used in the electronic industry. Improving thermal performance is numerically predicted using computational fluid dynamics (CFD) technique and experimental tests are carried out to verify the numerical predictions...

...Pradeep Hegde; K.N. Seetharamu; G.A. Quadir; P.A. Aswathanarayana; M.Z. Abdullah; Z.A. Zainal Purpose To analyze two‐phase flow in micro‐channel heat exchangers used for high flux micro‐electronics cooling and to obtain performance parameters such as thermal resistance, pressure drop, etc. Both...

... resistance of a stacked micro‐channel under different flow constraints obtained by using the one dimensional (1D) and two dimensional (2D) finite element methods (FEM) and by thermal resistance network model as well (proposed by earlier researcher). The 2D FEM is used to study the effect of two dimensional...