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Electronic sub‐assemblies are now a common feature of many products. The final output of production in areas such as computers, consumer goods, instrumentation and telecommunications equipment contain one or more electronic sub‐assemblies. Electronic sub‐assemblies are complex components built from smaller components such as Integrated Circuits (ICs) assembled on to Printed Circuit Boards (PCBs). Testing is an important but non‐productive part of the process of electronic sub‐assembly. However, it is a means of cost avoidance and ultimately a requirement for staying in business.

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