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Keywords: Die attachment
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Journal Articles
International Journal of Structural Integrity (2024) 15 (4): 702–716.
Published: 07 May 2024
...Mohammad A. Gharaibeh; Jürgen Wilde Purpose The purpose of this paper is to investigate the thermomechanical response of four well-known lead-free die attach materials: sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds. Design...
