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Keywords: Electronic engineering
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Journal Articles
International Journal of Structural Integrity (2013) 4 (2): 191–205.
Published: 24 May 2013
... that the accelerometer measured the actual shock profile experienced by the base of the specimens. This accelerometer was limited to measuring the profile in the direction of motion. Fracture Mechanical behaviour of materials Electronic engineering Reliability Micro‐electro‐mechanical systems Single crystal...
