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Keywords: Lead-free bonding
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Journal Articles
International Journal of Structural Integrity (2024) 15 (4): 702–716.
Published: 07 May 2024
... selection in power electronics. Anand viscoplasticity Transient liquid phase Die attachment Lead-free bonding Power electronics Over the past few decades, there has been a significant increase in the demand for reliable and cost-effective electronics. However, one common issue that leads...
