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Volume 171, Issue 4
1 November 2018
Proceedings of the Institution of Civil Engineers - Civil Engineering Cover Image for Volume 171, Issue 4
Brief Report| September 24 2018

Engineering modular systems for high-rise buildings: an update Available to Purchase

Wei Pan;
Wei Pan
For further information please contact: Wei Pan Email: wpan@hku.hk Web: www.hku.hk
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Ray Su;
Ray Su
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Yancheng Cai;
Yancheng Cai
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Ben Young
Ben Young
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Author & Article Information
For further information please contact: Wei Pan Email: wpan@hku.hk Web: www.hku.hk
Publisher: Emerald Publishing
Online ISSN: 1751-7672
Print ISSN: 0965-089X
ICE Publishing: All rights reserved
2018
Proceedings of the Institution of Civil Engineers - Civil Engineering (2018) 171 (4): 148.
https://doi.org/10.1680/jcien.2018.171.4.148

Off-site manufacture of ‘plug and play’ modules is fast gaining ground in the plant and housing sectors. Wei Pan, Ray Su, Yancheng Cai and Ben Young of The University of Hong Kong outline the engineering challenges of modular high-rises and suggest some solutions.

ICE Publishing: All rights reserved
2018
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