By means of the theory of complex variable functions, dynamic extension queries solutions of symmetrical mode III interface cracks in bismuth-copper alloys were researched in this paper. The crack extension should also appear in the form of self-similarity because interface failure is ascertained by the maximum tensile stress. The formulation involves the development of a Riemann-Hilbert problem. The issues which were considered can be very easily transformed into Riemann-Hilbert problem according to the methods of self-similar functions, and the general representations of analytical solutions of the stresses, displacements and dynamic stress intensity factors for the edges of symmetrical mode III interface crack subjected to moving enhancive loadings Px 6/t 6 and Pt 7/x 6. In the light of correlative material properties, the changeable law of dynamic stress intensity factor was illustrated very well. The solutions were obtained by application of superposition principle in this paper, and the solutions of discretionally intricate queries could be readily acquired.
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14 June 2016
Research Article|
June 14 2016
Dynamic solutions on mode III interface cracks in bismuth-copper
Nianchun Lü, PhD;
Nianchun Lü, PhD
*
Associate Professor
School of Material Engineering, Shenyang Ligong University, Shenyang, China
*Corresponding author e-mail address: lvnianchun@sina.com
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Qian Xiang, MSc;
Qian Xiang, MSc
Postgraduate Student
School of Material Engineering, Shenyang Ligong University, Shenyang, China
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Guodong Hao, PhD;
Guodong Hao, PhD
Professor
Department of Chemistry, Mudanjiang Normal College, Mudanjiang, China
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Yuntao Wang, PhD
Yuntao Wang, PhD
Associate Professor
College of Mechanical Engineering, Liaoning Technical University, Fuxin, China
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*Corresponding author e-mail address: lvnianchun@sina.com
Publisher: Emerald Publishing
Received:
February 26 2015
Accepted:
January 13 2016
Online ISSN: 2046-0155
Print ISSN: 2046-0147
ICE Publishing: All rights reserved
2016
Emerging Materials Research (2016) 5 (1): 67–73.
Article history
Received:
February 26 2015
Accepted:
January 13 2016
Citation
Lü N, Xiang Q, Hao G, Wang Y (2016), "Dynamic solutions on mode III interface cracks in bismuth-copper". Emerging Materials Research, Vol. 5 No. 1 pp. 67–73, doi: https://doi.org/10.1680/jemmr.15.00019
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